Dare to climb, challenge and innovate

Dare to climb, challenge and innovate

Aspire to become a world leading manufacturer of semiconductor core spare parts and critical consumables
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Focus on quality and share value

Focus on quality and share value

Tackling semiconductor core spare parts and critical consumables, empowering advanced semiconductor processes
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Hand in hand, create a better future together

Hand in hand, create a better future together

Promise to provide customers with the highest quality products and services!
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Product Center

We primarily focus on the research, development, production, sales, and service of core spare parts and critical consumables for the semiconductor and optoelectronic display industries. Our product portfolio includes graphite products, SiC-coated products, TaC-coated products, Solid SiC products, sintered SiC products, semiconductor grinding consumables, semiconductor polishing consumables, semiconductor process films, as well as advanced adhesives for Mini & Micro-LED packaging and cutting-edge semiconductor assembly applications. These products are widely used in key semiconductor manufacturing processes such as SiC/Si/LED crystal growth, epitaxy, chip fabrication, and packaging.

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SiC Electrode

SiC Electrode

Substrate：CVD SiC（purity>6N）

Features：High Purity, corrosion resistance, high strength, stable chemical properties

SiC Ring

SiC Ring

Substrate：CVD SiC（purity>6N）

Features：High Purity, corrosion resistance, high strength, stable chemical properties

Si Ring

Si Ring

Substrate：Si（purity>6N）

Features：High Purity, corrosion resistance, high strength, stable chemical properties

Si Electrode

Si Electrode

Substrate：Si（purity>6N）

Features：High Purity, corrosion resistance, high strength, stable chemical properties

Company Profile

Hunan Combination Semiconductor Technology co. , Ltd.

CSM is mainly engaged in the research and development, production, sales, and service of core spare parts and key consumables in the semiconductor and optoelectronic display industry. It includes graphite products, SiC coating products, TaC coating products, Solid SiC products, sintered SiC products, semiconductor grinding consumables, semiconductor polishing consumables, semiconductor process film materials, semiconductor Mini&Micro LED packaging, and advanced semiconductor packaging adhesives. It is widely used in SiC/Si/LED long crystal, epitaxial, chip, packaging and other semiconductor core processes.

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Research and Development

Research and Development

CSM boasts an experienced R&D team with extensive expertise in the semiconductor, optoelectronic display, and broader semiconductor industries. The team has been deeply immersed in these fields for many years, bringing an internationally oriented perspective to product design and iteration. They possess a solid theoretical foundation as well as practical experience in process development and optimization, enabling them to precisely grasp customer needs and deliver comprehensive, tailored solutions.

Core Advantages

Defining the future together with you

R&D + Quality + Delivery + After-sales

Leveraging its technological expertise, CSM strives for exceptional quality, remains committed to driving innovation, and delivers products and services that are even more reliable.

News Updates

We primarily focus on the research, development, production, sales, and service of precision, high-purity components used in semiconductor manufacturing processes. Our main products include TaC/SiC-coated graphite parts, solid SiC components, and SiC crystal growth thermal systems.

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2025-07-18

The 13th Semiconductor Equipment, Core Components, and Materials Exhibition (CSEAC 2025) will open in Wuxi this September.

From September 4 to 6, 2025, the 13th Semiconductor Equipment, Core Components, and Materials Exhibition (CSEAC 2025) will be held at the Wuxi Taihu International Expo Center.

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2025-04-18

2025 SiC Market Trends: Technological Breakthroughs, Price Wars, and Industry Restructuring

Silicon carbide (SiC), the core material of the third-generation semiconductors, has demonstrated immense application potential in fields such as new-energy vehicles, photovoltaic energy storage, and 5G communications, thanks to its high breakdown electric field strength, exceptional thermal conductivity, and superior temperature resistance. In 2024, China's SiC substrate and epitaxial wafer markets experienced dramatic price fluctuations alongside significant capacity expansion. Notably, the price of 6-inch SiC substrates has already approached cost parity, while breakthroughs in 8-inch technology are rapidly advancing. As market competition intensifies, the primary driver behind falling prices is the rapid growth in downstream demand, further fueled by increased competition among domestic suppliers, which is accelerating the downward trend.

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2025-04-02

Analysis of the Current Status and Development Trends in the 2025 Silicon Carbide Device Industry: A Life-or-Death Situation Amidst Technology Substitution, Price Wars, and Domestic Substitution

When the price of domestically produced SiC modules first drops below that of imported IGBTs, when 8-inch silicon carbide substrates break through technological barriers, and when demand from new-energy vehicles drives market growth—by 2025, the silicon carbide device industry is undergoing a critical battle defined by technological substitution, price wars, and the rise of domestic alternatives.

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2025-02-22

The Transformation of the SiC Industry: The Dual Impact of Capacity Expansion and Price Wars

Over the past few years, with careful strategic planning, the SiC industry has ushered in a significant transformation in 2024. The rapid deployment of new production capacity, coupled with the remarkable improvement in performance of domestically produced SiC devices, has enabled automotive applications to gradually expand from peripheral components into core areas such as electric drives and power controls. While achieving greater self-reliance and control, SiC product prices have also begun to decline sharply. Market forecasts suggest that by 2025, the cost of integrating SiC into vehicles will continue to drop further, paving the way for SiC technology to be adopted more widely in affordable, mainstream models.

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2024-12-23

China's SiC industry faces a test: Challenges and opportunities brought about by changing market conditions!

In recent years, with the rapid growth of electric vehicles and the new energy industry, silicon carbide (SiC), as a crucial semiconductor material, has seen continuously rising market demand. However, as we entered 2024, China's SiC industry has encountered unprecedented challenges. Changes in the market environment, sharp price fluctuations, and intensifying competition have left the future of this burgeoning industry fraught with uncertainty.

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Please contact us—CSM is here to provide you with expert, customized services.

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Hunan Combination Semiconductor Technology co. , Ltd.

Service Hotline

86 155 8093 8874

Email: sales@lh-csm.com
Address: 204-013, Building Q01, Changsha Zhigu Industrial Park, No. 116, Huizhi North Road, Dongfanghong Street, Xiangjiang New Area, Changsha City, Hunan, China

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